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[News] Lenovo's Innovative Package with Pulp Molding Processing

Release time:

Jul 27,2022

innovative package is presented by Package Team from Lenovo PC. It is one of the package representatives with “LOW CARBON” concept.

Case Display Presented by EIPTC

Lenovo ThinkPad X1 and Z Series

(Photo | Previous Package Design by Lenovo, Break-up)

(Photo | Previous Package Design by Lenovo, Enclosed)

[New “LOW CARBON” Package]

Details as below

Adopting paper-cushion design as the replacement

(Photo | New “LOW CARBON” Package Design by Lenovo, Break-up)

(Photo | New “LOW CARBON” Package Design by Lenovo, Enclosed)

This innovative package is presented by Package Team from Lenovo PC. It is one of the package representatives with “LOW CARBON” concept.

News shared by EIPTC, and Translated by Minjie

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